Equipment

Denton Sputterer

Denton Sputterer

Model:

Denton Vacuum DESK-II DC Sputtering System

Capabilities:

These tools allow simple deposition of metallic films for (primarily) enhancing electrical conductivity.

Cost:

For UR users

For nonUR users

Calendar for Reservations:

PPMS Scheduler

Specifications:

  • Cold Sputter and Etch System for Coating SEM Samples.
  • Self contained cool sputter coater.
  • Automatic or manual operation.
  • Magnetron sputterhead.
  • 6 in. dia. pyrex chamber.
  • Sputtering and etch modes.
  • Gold and Platinum targets installed (Au/Pd and Ag available)

These small sputtering systems use a DC bias to generate an argon plasma which is accelerated towards and consequently sputters away the target metal. Metal particles then conformally cover all the surfaces inside the vacuum chamber. This technique is semi-directional possibly leaving some shadowed areas with less coverage. Deposition rates are nominally ~5nm/min.