Equipment

Mask Aligner

Mask Aligner

Model:

OAI 200 Mask Aligner

Capabilities:

This tool is capable of making patterns in photoresist using a transmission mask.

Cost:

For UR users

For nonUR users

Calendar for Reservations:

PPMS Scheduler

Specifications:

  • chucks for various size substrates.
  • optical microscope front-side alignment.
  • hard and soft contact modes. 
  • about 1um resolution with an appropriate mask

The Model 200 is a bench top mask aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The alignment module features mask insert sets and quick-change wafer chucks that facilitate the use of a variety of substrates and masks without requiring special tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and Z-axis. A dependable OAI UV light source provides collimated near UV light. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily.