Equipment

Thin Film Deposition Tool

pvd sputter evap

Model:

KLJ PVD-75 (Hybrid)

Capabilities:

Thin film deposition tool, using plasma sputtering or electron beam evaporation.

Cost:

For UR users

For nonUR users

Calendar for Reservations:

PPMS Scheduler

Specifications:

  • RF (insulating materials) or DC (conductive material) deposition.
  • E-beam evaporation deposition.
  • Support for substrates up to 6".
  • Sapphire crystal thickness monitor.
  • Substrate heating to 300C.
  • Easy to use touchscreen interface.

Ions are accelerated towards the source material (2" target), ablating away material which is then deposited onto the substrate. This deposition cloud results in good sidewall coverage of substrate features. E-beam evaporation, in contrast, uses a beam of electrons to evaporate material under vacuum which condenses on the substrate. This process is line of sight, and produces high quality films with high contrast edges.