Equipment

Reactive Ion Etcher (Tool A)

Reactive ion etcher

Model:

South Bay Technology Reactive Ion Etcher RIE-2000

Capabilities:

Using reactive gasses and RF power to create a chemcially reactive plasma, material is not only removed by sputtering from incident ions, but also through chemical interactions with the ionized gasses. This sets apart RIE techniques from standard inert plasma etching.

Cost:

For UR users

For nonUR users

Calendar for Reservations:

PPMS Scheduler

Specifications:

  • Support for up to 6" diameter substrates.
  • Common gasses: Ar, O2, CHF3.
  • Tool specific gasses: Cl2, SF6.
  • Up to 300W RF Max.
  • Anisotropic plasma etch process.

These tools use a chemically reactive plasma for dry etching of a variety of thin films.