Equipment
Plasma Process CVD Oven
Model:
YES 1224P
Capabilities:
This tool is capable of applying coatings that modify the surface properties of substrates for further processing.
YES Silane Vapor Deposition System Benefits:
- Chemical deposition uniformity
- Contact angle control within +/- 3degrees
- Moisture resistant surface modification
- Hexamethyldisilizane (HMDS)/wafer bonds will last for weeks with no change to surface adhesion
- Promotes Silane/substrate bonds
- Angstrom-level thickness control
- Increased MEMS and bioMEMS reliability
- Reduced chemical usage over wet chemical modification
- Plasma cleaning option (YES-1224P) ensures all runs start from the same point
Cost:
Calendar for Reservations:
Dehydration followed by silane vapor deposition coating provides a superior silane/substrate bond that is stable after exposure to atmospheric moisture, extending the time available between process steps.
Chemical usage for a vapor deposition process is typically less than 1% of the amount needed for wet application processes, significantly reducing waste and chemical costs.
The vapor deposition process begins with vacuum chamber cycle purges to dehydrate the product. The chamber is evacuated to low pressure and refilled with pure nitrogen several times to completely remove water vapor. Nitrogen is preheated, which helps heat the product. Once cycle purges are finished, the YES-1224P system pumps the chemical directly from the source bottle to the heated vaporization chamber – without exposing the chemical to moisture. YES-1224P accommodates two chemical source bottles (option for 3) as well as wide variations of vapor pressures among different silanes.
Processes are easily programmed using a touch screen operator interface. Plasma cleaning prior to silane deposition improves repeatability. Plasma cleaning the process chamber before each run ensures all runs start from the same point. Additionally, plasma prepares the substrate for deposition.